EuroHPC JU Issues €30M Call for SME HPC Competitiveness

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)

HPC datacenters have been improving their energy consumption and environmental sustainability profiles. Verne Global, a high-intensity-compute cloud colocation services provider, has emerged as a leader in delivering 100 percent renewable, global HPC cloud resources, powered by Iceland's natural hydroelectric and geothermal energy. Digital 9 Infrastructure plc (D9), a newly formed UK- based investment trust company that invests in a range of digital infrastructure assets, has acquired Verne Global in a deal valued at approximately £231 million.