Description
Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)
