UCSD To Create a New School to Advance Data Science and Prepare Graduates to Propel Innovations in AI

During the recent conference held by the Special Interest Group on Knowledge Discovery and Data Mining held in Singapore, three international public science policy advocacy groups presented a guide, Using Artificial Intelligence to Support Healthcare Decisions, aimed at empowering and educating the public on the growing use of AI platforms in the healthcare decision-making process. The guide covers explanations of common applications of artificial intelligence platforms in healthcare and, more importantly, outlines specific questions one can pose to cut to the core of the efficacy and reliability of an AI platform in those applications.

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)