ETP4HPC Releases 6th Edition of its Strategic Research Agenda

In an announcement made in December, 2021, Verusen, a startup specializing in leveraging AI resources to support global supply chains, detailed a recently formed partnership with Machine Compare, a supplier of one of the world's largest databases for machinery and leading B2B marketplace for buyers and sellers of industrial spare parts. The partnership is aimed at enhancing the customer experience, limiting risk, reducing waste, and helping companies conduct materials management and commerce in a new and efficient way. Verusen founder and CEO Paul Noble explains the partnership is targeted to resolve a painful and wasteful process and will ultimately allow manufacturers to realize a whole new level of sustainability. For his part, Machine Compare CEO Ben Findlay is looking for a reduction in downtime, stockouts, and costs. Furthermore, the burdens lifted by the Verusen AI capabilities are targeted to reduce the amount of manpower committed to time-consuming, reactive tasks, allowing for a more proactive and long-term management of goals.

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)