
CoreWeave Launches First GB200 Cloud Service for AI
$1,500.00
Authors: Jaclyn Ludema and Mark Nossokoff
Publication Date: February 202025
Length: 1 pages
CoreWeave has announced the general availability of NVIDIA GB200 NVL72-based instances, marking a significant milestone in the cloud computing landscape, particularly for AI and high-performance computing (HPC). CoreWeave claims to be the first cloud provider to offer these advanced instances, which are designed to enhance the training, deployment, and scaling of complex AI models.
Related Products
Opportunity for DNA as a New Archive Storage Medium
Mark Nossokoff and Bob Sorensen
Using biological building blocks in place of traditional materials to assemble computers has been a research topic for many years, but recently the first potential commercial use cases have begun to emerge, centered on storage for large data sets. The DNA Storage Alliance, created to promote a storage ecosystem based on synthesized DNA strands, recently shared their aspirations for the emerging technology that offers significant promise in durability, simplicity, cost, and density over traditional magnetic counterparts. The initial goals of the alliance are to educate the public and raise awareness about DNA-based storage. Further out, the alliance may pursue the creation of specifications and standards, such as encoding, physical interfaces, retention, and file systems, to ensure that DNA-based solutions complement existing storage hierarchies. The alliance notes that expectations for the growth rate of current storage mechanisms cannot keep pace with the rising demand for data storage, particularly where growing data retention and related data mining efforts are driving the need to save increasingly larger data sets for longer periods of time. Such requirements are well suited to DNA-based archive storage characteristics in applications including digital content creation, robotics, smart cities, autonomous vehicles, healthcare, astronomy, and climate science.
8 202021 | HYP_Link
European Processor Initiative Milestone: Release of Processor Test Chip for Fabrication
Bob Sorensen and Earl Joseph
The European Processor Initiative (EPI) recently announced that it had released its European Processors Accelerator Chip (EPAC1.0) test chip design to a semiconductor maker for fabrication. The chip consists of multiple accelerator options including a vector processing unit, a stencil and tensor accelerator, and a variable precision processor, along with supporting RISC-V cores and memory access hardware. The 25 mm2 chip will be manufactured by US-based semiconductor maker Global Foundries using their low-voltage, low-power, 22 nanometer, 22FDX process platform.
6 2021 | HYP_Link