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  • HPC Profiles in Leadership: DUG Technology
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HPC Profiles in Leadership: DUG Technology

$2,500.00

Authors: Mark Nossokoff and Jaclyn Ludema

Publication Date: October 2023

Length: 3 pages

Category: Special Report
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Description

Innovations are constantly occurring across all aspects of HPC infrastructure. Much of that innovation has been focused on the computing infrastructure:

  • CPU performance once driven by faster clock speeds have evolved to integrating more cores.
  • GPUs have emerged to advance performance of AI-related workloads.
  • Application-specific accelerators are now being introduced to address unique elements of AI applications.

Advancements in these areas have created challenges in other areas, primarily related to the increasing power required to run each new generation of processing element. Innovations in equipment cooling and datacenter design and operations are evolving to address the power and cooling challenges. Specifically, immersion cooling has emerged as an option to mitigate increasing power demands and aims to provide substantial benefits to datacenter facilities. DUG Technology (DUG) has fully embraced immersion cooling for its computing infrastructure and provides a proof point for others considering taking the immersion cooling approach.

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