Late last month, US Department of Defense (DOD) leadership explored the potential to inculcate artificial intelligence (AI) processes into its overall military operations, signaling a fundamental change in how information and data are used to increase the decision space for leaders both in military and civilian domains. Delivered during the third and most recent iteration of the Global Information Dominance Experiment (GIDE 3), which included representatives from all 11 combatant commands, NORTHCOM Commander Gen. Glen D. VanHerck’s remarks on AI were aimed at progressing the ability to maintain domain awareness, achieve information dominance, and provide decision superiority in both competition and crisis.
AI Powered Verusen and Machine Compare Partnership Targets Supply Chain Pain Points
Tom Sorensen, Alex Norton
In an announcement made in December, 2021, Verusen, a startup specializing in leveraging AI resources to support global supply chains, detailed a recently formed partnership with Machine Compare, a supplier of one of the world's largest databases for machinery and leading B2B marketplace for buyers and sellers of industrial spare parts. The partnership is aimed at enhancing the customer experience, limiting risk, reducing waste, and helping companies conduct materials management and commerce in a new and efficient way. Verusen founder and CEO Paul Noble explains the partnership is targeted to resolve a painful and wasteful process and will ultimately allow manufacturers to realize a whole new level of sustainability. For his part, Machine Compare CEO Ben Findlay is looking for a reduction in downtime, stockouts, and costs. Furthermore, the burdens lifted by the Verusen AI capabilities are targeted to reduce the amount of manpower committed to time-consuming, reactive tasks, allowing for a more proactive and long-term management of goals.
1 202022 | HYP_Link
European Processor Initiative Milestone: Release of Processor Test Chip for Fabrication
Bob Sorensen and Earl Joseph
The European Processor Initiative (EPI) recently announced that it had released its European Processors Accelerator Chip (EPAC1.0) test chip design to a semiconductor maker for fabrication. The chip consists of multiple accelerator options including a vector processing unit, a stencil and tensor accelerator, and a variable precision processor, along with supporting RISC-V cores and memory access hardware. The 25 mm2 chip will be manufactured by US-based semiconductor maker Global Foundries using their low-voltage, low-power, 22 nanometer, 22FDX process platform.