RISC-V Gains Ground with New Qualcomm Joint Venture

Recently, the Barcelona Supercomputing Center (BSC) trained the first large artificial intelligence (AI) model designed to understand, speak, and write in the Spanish language. The system, named MarIA, was trained on the MareNostrum supercomputer at the BSC, leveraging 59 TBs of language data from the Biblioteca Nacional de España, one of the world's largest public libraries. The model is said to be an expert in both writing and understanding the Spanish language and is free to use by any developer, company, or entity. The system has a wide variety of potential applications including summarization applications, chatbots, smart searches, translation engines, and automatic subtitling chatbots.

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)