RISC-V Gains Ground with New Qualcomm Joint Venture

Building on its Budget 2021 commitment to launch a seven year $360 million National Quantum Strategy, the Government of Canada recently stood up a public survey website to gather insights on how to implement the plan. The survey covers a comprehensive set of issues including best practices on academic, government and private sector partnerships, talent and workforce challenges and opportunities, mechanisms to ensure equity, diversity, and inclusion, adoption of quantum technologies by Canadian entities, and identification of any significant gaps, barriers, or challenges that could hinder Canadian efforts to become a global leader in quantum technologies.

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)