New UK AI Policy Puts Innovation First

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)

At the conclusion of 2021, researchers at UNC Charlotte and Duke University Medical Center published results of work done to use transfer learning methods to generate fluence maps for radiation therapy, aimed at providing medical professionals with more capability and information in fighting adrenal cancers. The technique uses a deep transfer learning model trained on a much larger dataset that can be applied to a smaller data set for a specific application.

• The initial model was trained on pancreas treatment plans, then retuned and applied to a smaller set of data points on adrenal cancers. The output of the model generates a fluence map for specific IMRT beam-based treatments for adrenal cancers.
• According to the researchers, this approach is meant to supplement but not replace human expertise in the field and is reliant on human expertise to finetune and improve the AI model.