Description
The ongoing demand for more powerful AI and HPC is creating significant thermal challenges in many data centers. As AI chips continue to advance in capability, they are generating substantial levels of heat, pushing conventional cooling technologies closer to their operational limits. A developing technology, microfluidic cooling, has emerged as a candidate solution to this challenge. Recent tests by Microsoft, in collaboration with Swiss startup Corintis, have demonstrated an innovative approach: moving cooling from the outside of the chip package to the interior of the silicon chip itself.
