Japan Stands Up Quantum Technology Industry Group to Boost Commercial Quantum Prospects

MLCommons, an international artificial intelligence (AI) standards body formed in 2018, launched MLPerf Tiny, their first benchmark targeted at the inference capabilities of edge and embedded devices, or what they call "intelligence in everyday devices". The new benchmark is now part of the overall MLPerf benchmark suite, which measures AI training and inference performance on a wide variety of workloads, including natural language processing and image recognition. The benchmark covers four machine learning (ML) tasks focused on camera and microphone sensors as inputs: keyword spotting, visual wake words, tiny image classification, and anomaly detection. Some important use cases include smart home security, virtual assistants, and predictive maintenance.

The European Processor Initiative (EPI) recently announced that it had released its European Processors Accelerator Chip (EPAC1.0) test chip design to a semiconductor maker for fabrication. The chip consists of multiple accelerator options including a vector processing unit, a stencil and tensor accelerator, and a variable precision processor, along with supporting RISC-V cores and memory access hardware. The 25 mm2 chip will be manufactured by US-based semiconductor maker Global Foundries using their low-voltage, low-power, 22 nanometer, 22FDX process platform.