Authors: Bob Sorensen and Earl Joseph
Publication Date: 6 2021
Length: 1 pages
Japan’s NTT, the fourth largest telecommunications company in the world, recently announced the formation of a cooperative organization of Japanese firms designed to promote Japan’s technical position in quantum technologies and to help Japan complete globally with US and Chinese rivals in both quantum computing and quantum communications. The inaugural meeting of the group, held in late May 2021, was attended by 11 Japanese companies, including leading IT suppliers Fujitsu, Hitachi, NEC, and Toshiba as well as industrial partners including Toyota Motor, Mitsubishi Chemical, and the Mizuho Financial Group. More than 50 companies are ultimately expected to join the group.
MLCommons, an international artificial intelligence (AI) standards body formed in 2018, launched MLPerf Tiny, their first benchmark targeted at the inference capabilities of edge and embedded devices, or what they call "intelligence in everyday devices". The new benchmark is now part of the overall MLPerf benchmark suite, which measures AI training and inference performance on a wide variety of workloads, including natural language processing and image recognition. The benchmark covers four machine learning (ML) tasks focused on camera and microphone sensors as inputs: keyword spotting, visual wake words, tiny image classification, and anomaly detection. Some important use cases include smart home security, virtual assistants, and predictive maintenance.
6 202021 | Uncategorized
The European Processor Initiative (EPI) recently announced that it had released its European Processors Accelerator Chip (EPAC1.0) test chip design to a semiconductor maker for fabrication. The chip consists of multiple accelerator options including a vector processing unit, a stencil and tensor accelerator, and a variable precision processor, along with supporting RISC-V cores and memory access hardware. The 25 mm2 chip will be manufactured by US-based semiconductor maker Global Foundries using their low-voltage, low-power, 22 nanometer, 22FDX process platform.
6 2021 | Uncategorized