IonQ Plans to Establish First Dedicated US-based QC Manufacturing Facility

Survey respondents cited GPUs as the most anticipated processing element within the next 12-18 months at a rate of 74%. When asked about which processing elements they expect to be incorporated into their HPC/AI/HPDA computing resources, the majority of respondents across all sectors expected GPUs to be first (74.0%) and TPUs (24.3%) as next most anticipated. Government and academia respondents reported the highest expectation at a rate of 84%. This data is from the eighth annual study of Hyperion Research's high-performance computing (HPC) end-user-based tracking of the HPC marketplace. It included 181 HPC end-user sites with 3,830 HPC systems.

During the recent Wells Fargo 2022 TMT Summit, Mark Papermaster, CTO of AMD, reported that the Instinct MI300 accelerated processing unit (APU) is, as of early December 2022, up and running. Currently confined to their in-house lab, the Instinct MI300 will be used in the exascale supercomputer currently in development at Lawrence Livermore National Laboratory, El Capitan, scheduled to be delivered in 2024. Described by Papermaster as a "true datacenter APU," AMD expects general availability of the processor in 2023. This multi-chiplet processor makes use of both AMD's Zen 4 (x86) CPU architecture and CDNA 3, AMD's GPU architecture, designed specifically with exascale computing in mind, and will be produced by Taiwan's TSCM at the 5nm process node. Papermaster sees this development as an important way to continue introducing greater density and optimization into components now that the sector is no longer in the era of the "old Moore's Law."