HPE GreenLake Partners with AWS for Seamless Hybrid Clouds

The European Processor Initiative (EPI) recently announced that it had released its European Processors Accelerator Chip (EPAC1.0) test chip design to a semiconductor maker for fabrication. The chip consists of multiple accelerator options including a vector processing unit, a stencil and tensor accelerator, and a variable precision processor, along with supporting RISC-V cores and memory access hardware. The 25 mm2 chip will be manufactured by US-based semiconductor maker Global Foundries using their low-voltage, low-power, 22 nanometer, 22FDX process platform.

The US government recently stood up a consortium of six Washington D.C.-based federal agencies to explore a range of quantum technologies necessary to create, demonstrate, and operate DC-QNet, a regional, multi-kilometer quantum network testbed. The six participating agencies span a range of US government mission agencies including the National Security Agency, the US Naval Research Laboratory, the National Institute of Standards and Technology, and the National Aeronautics and Space Administration. The program targets key underlying technologies needed to implement a metro[1]area quantum network that includes high-fidelity quantum memory, single photon devices, and related network metrology as well as mechanisms to support quantum entanglement between network nodes in a quantum computer. Details about project schedule and budget have not yet been made available, but each participating agency will be responsible for funding its research activities.