HPE Enters Public AI LLM Cloud Market with HPE GreenLake

Late last month, US Department of Defense (DOD) leadership explored the potential to inculcate artificial intelligence (AI) processes into its overall military operations, signaling a fundamental change in how information and data are used to increase the decision space for leaders both in military and civilian domains. Delivered during the third and most recent iteration of the Global Information Dominance Experiment (GIDE 3), which included representatives from all 11 combatant commands, NORTHCOM Commander Gen. Glen D. VanHerck's remarks on AI were aimed at progressing the ability to maintain domain awareness, achieve information dominance, and provide decision superiority in both competition and crisis.

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)