European Processor Initiative Milestone: Release of Processor Test Chip for Fabrication

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)

Ten leading German corporations recently stood up the Quantum Technology and Applications Consortium (QUTAC) to explore and promote the commercial application of quantum computing (QC) targeted for the German industrial base as a way to ensure German competitive advantage across a broad array of industries. The effort spans industrial sectors and founding members that include automotive manufacturing (Bosch, BMW, and Volkswagen), chemical and pharmaceutical (BASF, Boehringer Ingelheim, and Merck), insurance (Munich Re) and technology (Infineon, SAP, and Siemens). AIRBUS is participating as an external contributor.