EuroHPC JU Call for Innovative Action in Interconnects Closes

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)

The U.S. Senate passed the United States Innovation and Competition Act (USICA) on June 8th, a major step forward in providing support and financial investment in furthering the United States' competitive capabilities in technology, including semiconductor capabilities. The USICA is bipartisan legislation intended to give federal funding to key science and technology areas, including STEM research, technology transfer, semiconductor research and manufacturing, as well as NASA research activities. The bill also seeks to establish a framework for agencies including the NSF and DOE to collaborate in these areas, to help ensure U.S. leadership in science and technology.