Barcelona Supercomputing Center Trains Spanish NLP Model

Seeking to establish a die-to-die interconnect standard and foster an open chiplet ecosystem, a strong collection of major chip makers and users recently announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry consortium. The consortium has published version 1.0 of the UCIe specification, covering the die-to-die I/O physical layer, die-to-die protocols, and software stack. Promoter members of the consortium are Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC)

On February 8, 2022, the European Commission formally proposed what's commonly referred to as the European Chips Act. The legislation plans to build on Europe's strengths and address weaknesses to develop a thriving domestic semiconductor ecosystem and resilient supply chain, while setting measures to anticipate and respond to future supply chain disruptions. In the short term, the Act seeks to bolster EU capabilities to anticipate future chips crises, strengthen manufacturing activities in the EU, and support scale-up and innovation across the whole value chain. In the mid- to long-term, it seeks to reinforce Europe's technological leadership while developing mechanisms to support transfer of knowledge from the lab to the fab and position Europe as a technology leader in innovative downstream markets.