A View of the 2018 HPC Market by Competitive Segments

The Department of Energy at Oak Ridge National Laboratory (ORNL) recently announced plans for the development of a 1.5 exaflops system called Frontier to be delivered in 2021. US HPC maker Cray and chip maker AMD are the two key US commercial partners in this effort. Despite numerous press articles centered on the 1.5 exaflops peak performance of Frontier, ORNL's original RFP released in April of 2018 clearly called out the diverse workload requirements that Frontier would have to successfully handle that span the traditional modeling and simulation sector, big data analysis, and AI applications, while demonstrating a 50X improvement in solving key DOE science problems that today run at the 20 petaflops level. To meet those ambitious goals, strong support from DOE's companion $1.7 billion Exascale Computing Project (ECP) will be critical.

This Quick Take looks at Amazon's recent announcement of a new EC2 Bare Metal offering that provides users with direct, non-virtualized access to a processor, memory, storage and related networking instance. Amazon uses custom hardware in an effort to wring out the highest possible performance from the basic hardware set up while still offering a full complement of cloud-based software support. This development is a positive one for HPC users looking to migrate workloads to public clouds as Amazon is addressing one of the most vexinghurdles of HPC in the cloud: the performance overhead of running applicationsin a virtualized, performance limiting environment.