The newly-formed Ultra Ethernet Consortium (UEC) seeks to establish an open, interoperable, high-performance architecture leveraging the broad Ethernet ecosystem. With founding members including AMD, Arista, Broadcom, Cisco, Eviden, HPE, Intel, Meta, and Microsoft, the UEC envisions a system interconnect solution that will capitalize on the ubiquity and flexibility of Ethernet to address demanding heterogenous HPC and AI performance, functionality, and scalability requirements.
AI-Centered Partnership Between OMRON and Kyoto University Targets Cardiovascular Diseases
Tom Sorensen, Alex Norton
At the recent CES 2022 tech event, Japanese corporation OMRON, the world’s leading manufacturer and distributor of personal heart health products and other medical devices, highlighted (and later announced on their website) the activities of their partnership with Kyoto University to develop an AIpowered platform that uses remotely gathered patient data to predict cardiovascular diseases at an earlier stage than current averages. Kyoto University is closely tied to the identity of Japan's government and considered Japan's leading research university. They operate a Top500 HPC system on-site in addition to conducting research on the cutting edge Fugaku supercomputer. This new program, part of an ongoing partnership between the two organizations, seeks to explore the use of AI to analyze blood pressure metrics for early detection of cardiovascular diseases faster and with greater accuracy allowing for treatment courses to be changed or taken more quickly.
1 202022 | HYP_Link
European Processor Initiative Milestone: Release of Processor Test Chip for Fabrication
Bob Sorensen and Earl Joseph
The European Processor Initiative (EPI) recently announced that it had released its European Processors Accelerator Chip (EPAC1.0) test chip design to a semiconductor maker for fabrication. The chip consists of multiple accelerator options including a vector processing unit, a stencil and tensor accelerator, and a variable precision processor, along with supporting RISC-V cores and memory access hardware. The 25 mm2 chip will be manufactured by US-based semiconductor maker Global Foundries using their low-voltage, low-power, 22 nanometer, 22FDX process platform.