2021 Use of Public/External Clouds for HPC Workloads, Trends, and Drivers

The US Government's Office of Science and Technology Policy (OSTP) recently released a Federal strategic plan for a whole-of-nation approach to pioneering the future national advanced computing ecosystem that targets key application drivers and strategic objectives considered essential to US leadership, economic competitiveness, and national security. The plan specifically called out three critical application areas:

• • Extreme scale modeling and simulation
  • Data-intensive application workflows
  • End-to-end and real-time application workflows

The plan also arrays a number of key strategic objectives, including:

• • The development of an advanced ecosystem that spans government, academia, non-profits and industry
  • The support of foundational, applied and translational research
  • The expansion of a diverse, capable and flexible workforce

The strategic plan delineates US government agency roles and responsibilities and describes essential operational and coordination structures necessary to support and implement its objectives.

Although China represents more than one-third of the global market for semiconductors, the country relies heavily on foreign sources, especially U.S. chipmakers and foundries headquartered in other Asian countries, for a majority of devices critical to Chinese-made products ranging from smartphones to industrial machinery and supercomputers. For the past few decades, China sought to develop an indigenous capability in an effort to reduce its dependence on the foreign supply of components. Its most recent major effort, the “Made-in-China” semiconductor initiative launched in 2015, targeted supplying 40% of China's semiconductor demand with homegrown products by 2020 and 70% by 2025.